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Non-destructive Analysis (NDA)

Circuit Edit (CKT)

Materials Analysis (MA)

Application Forms

Software

MA-tek FTP

Laser Decap

Technical Concept

Laser decap is used to remove the epoxy or compound of IC packages by laser irradiation. This technology has the advantages of precisely localizing decap and lessening IC damage caused by decaping.

 

Laser decapsulation can precisely control the decapsulation open window and it can also prevent the IC from being damaged due to over decapsulation by the chemical way.

 

 

 

Applications

 

 

Selective opening the epoxy by laser decap

 

Check the 2nd bond quality 

 

 

Contact

Taiwan|SoC Lab

Chemical team

: +886-3-6116678 ext:3919/3920

: +886-922-301638

: chemical_hc@ma-tek.com

Taiwan|JB Lab

Chemical team

: +886-3-6116678 ext : 1601/1614

: +886-970-923-650

: chemical_jb@ma-tek.com

 

Shanghai Lab

Mr. Gao

: +86-21-5079-3616 ext:7011

: 182-2169-8031

chemical_sh@ma-tek.com