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Non-destructive Analysis (NDA)

Circuit Edit (CKT)

Materials Analysis (MA)

Application Forms


MA-tek FTP

CSR Report

Laser Decap

Technical Concept

Laser decap is used to remove the epoxy or compound of IC packages by laser irradiation. This technology has the advantages of precisely localizing decap and lessening IC damage caused by decaping.


Laser decapsulation can precisely control the decapsulation open window and it can also prevent the IC from being damaged due to over decapsulation by the chemical way.







Selective opening the epoxy by laser decap


Check the 2nd bond quality 




Taiwan|SoC Lab

Chemical team

: +886-3-6116678 ext:3919/3920

: +886-922-301638

: chemical_hc@ma-tek.com

Taiwan|JB Lab

Chemical team

: +886-3-6116678 ext : 1601/1614

: +886-970-923-650

: chemical_jb@ma-tek.com


Shanghai Lab

Mr. Gao

: +86-21-5079-3616 ext:7011

: 182-2169-8031