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Non-destructive Analysis (NDA)

Circuit Edit (CKT)

Materials Analysis (MA)

Application Forms

Software

MA-tek FTP

CSR Report

Laser Decap

Technical Concept

Laser decap is used to remove the epoxy or compound of IC packages by laser irradiation. This technology has the advantage of precisely localizing decap and lessening IC damage caused by decapping.

 

Laser decapsulation can precisely control the decapsulation open window and it can also prevent the IC from being damaged due to over decapsulation by the chemical way.

 

 

 

Applications

 

 

Selective opening the epoxy by laser decap

 

Check the 2nd bond quality 

 

 

Contact

Taiwan|SoC Lab

Chemical team

: +886-3-6116678 ext:3919/3920

: +886-922-301638

: chemical_hc@ma-tek.com

Taiwan|JB Lab

Chemical team

: +886-3-6116678 ext : 1601/1614

: +886-970-923-650

: chemical_jb@ma-tek.com

 

Taiwan|Tainan Lab

Ms. Xu

: +886-3-6116678 ext:5212

: +886-979-509-675

epfa_tn@ma-tek.com

Shanghai Lab

Mr. Gao

: +86-21-5079-3616 ext:7011

: 182-2169-8031

chemical_sh@ma-tek.com

 

Xiamen Lab

Ms. Huang

: - - - - - - -

: 180-207-45619

: aliexhuang@ma-tek.com