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Non-destructive Analysis (NDA)

Circuit Edit (CKT)

Materials Analysis (MA)

Application Forms

Software

MA-tek FTP

CSR Report

LED Industry

Analysis type

Applicable items

 

Reliability Testing

Environmental Test, Electrical Test, Lighting Test

X-ray Inspection

X-ray

Failure Analysis (FA)

Thermal, EMMI/InGaAs, OBIRCH

Texturing (Surface Morphology)

Optical profiler, SEM, TEM

Film Type and Thickness Measurement

SEM/EDX, TEM/EDX

Cell Structure

SEM/EDX, TEM/EDX

Crystalline Defects (Dislocations)

X-S TEM, P-V TEM

Depth Profiling of Elemental Analysis

TEM/EDX, SIMS

Contamination  Analysis

Auger, XPS

 

 

 

 

Reliability Testing

Reliability Testing Service

Analysis type

    Applicable items
 

Environmental Test

  • Temperature Cycling Test (TCT) & Thermal Shock Test (TST)
  • High Temperature Storage Test (HTST) & Low Temperature Storage Test (LTST)
  • Temperature & Humidity Storage Test (THST)
  • Temperature & Humidity with Bias Test (THB Test)
  • Vibration Test / Mecharical Shock Test / Drop Test
  • Pre-conditionong Test (MSL 1-6) & Reflow Test
  • Solderability Test
  • Autoclave (AC) Test & PCT (US-HAST) Test

Electrical

Test

  • Operation Lift Test (OLT) & Bias Lift Test (BLT)
  • High Temperature Reverse / Gate Bias (HTRB / HTGB) Test
  • Highly Accelerated Stress Test (HAST)
  • High Humidity High Temperature Reverse Bias (H3TRB) Test
  • Power & Temperature Cycle (PTC) Test
  • Hot Carrier Test (HCI)
  • Deliverables for recommended board design

LED Lighting

Test

  • Temperature & Humidity Storage / On-off Plus Operation
  • High / Low Temperature Storage / On-off Plus Operation
  • Highly Accelerated Stress Test / On-off Plus Operation
  • Thermal Shock (Air to Air) / On-off Plus Operation
  • High / Room / Low Temp. Burn-in Test / On-off Plus Operation

 

LED Reliability Testing Facilities

 

ESD, Latch-up, Testing/Wire Bonding

 

LED ESD Testing

 

 

 

X-ray Inspection

X-ray Photography

 

X-ray lnspection of LED

 

 

 

Failure Analysis (FA)

Thermal, EMMI/InGaAs,OBIRCH

Defect Localization by EMMI/InGaAs, OBIRCH

 

EMMI/InGaAs, OBIRCH for FA Application

 

 

 

Texturing (Surface Morphology)

Optical Profiler

 

Texturing (Surface Morphology) 


Surface morphology of LED die surface roughness after RIE etching or ion bombardment.

 

 

 

 

Chip Structure and Film Thickness

SEM, DB-FIB, TEM

X-S view SEM

 

 

Chip Structure and Film Thickness


Precise X-S view by DB-FIB

 

  


X-S view TEM

 

 

(a)MQW and super lattice;(b)HR TEM of MQW;(c)PSS and buffer layer

 

 

 

Crystalline Defects (Dislocations)

X-S TEM, P-V TEM

TEM Imaging (Dislocations in epitaxial butter layer)

 


X-S & P-V TEM at requested area to observe the dislocation density and its spatial distribution


 

 

 

 

Depth Profiling of Elemental Analysis

TEM/EDX, SIMS

EM/EDX Line Profile – Blue LED – MQW and Superlattice


In% in superlattice can be defected down to 0.2at%

 

 

Elemental Depth profile by SIMS


SIMS is also feasible now.
MA-tek can deliver 5-10 samples of backside SIMS analysis per day