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Non-destructive Analysis (NDA)

Circuit Edit (CKT)

Materials Analysis (MA)

Application Forms

Software

MA-tek FTP

CSR Report

Rework Station

Technical Concept

BGA rework station offers proven rework technology and procedure. It includes thermal demount from PCB (de-soldering), solder removal of irregular shaped residues, and soldering after re-ball of a wide spectrum of SMT components.

 

 

 

Equipment


FINEPLACER® coreplus

 

 

 

 

Applications

  • BGA, µBGA/CSP, QFN, PoP, QFP, PGA
  • Small passives
  • RF shields, RF frames
  • Connectors, sockets
  • Sub assemblies, daughter boards
  • Through hole technology pin in paste
  • Reworkable underfill, conformal coating

 

 

 

 

 

 

Benefits

  • Independent process operation
  • Fixed prism doesn’t need regular calibration
  • Fast de-soldering and soldering process
  • The complete rework cycle is a cost-effective system solution
  • Reproducible placement accuracy
  • Coordinated control of all process parameters: temperature, gas flow, soak time, process environment
  • Immediate visual feedback reduces process development time
  • Repeatable profiles from machine to machine

 

In addition, PCB underfill samples can be dismantled by particular tools. This methodology can be applied for underfill and solder removal such that the samples can be re-welded(reflow) for various SMT units.

 

 

 

Contact

Taiwan|SoC Lab

Chemical team

: +886-3-6116678 ext:3919/3920

: +886-922-301638

: chemical_hc@ma-tek.com