We use cookies to improve your experience. By your continued use of this site you accept such use. To change your settings please see our Privacy Policy.

Non-destructive Analysis (NDA)

Circuit Edit (CKT)

Materials Analysis (MA)

Application Forms

Software

MA-tek FTP

Reliability Test service

Reliability is the ability of products to perform specific function(s) at standard technical conditions for a specific period of time. Reliability is measured with failure probability, failure rate, and maintainability of products. Based on projected/actual technical specification of products and customer requirements, different reliability tests are performed as per different reliability testing standards via. MIL-STD, JEDEC, IEC, JESD, AEC, and EIA. 

 

 

 

Technical Concept

Reliability is the probability of performing without failure at a specific function under given conditions for a specific period of time.

 

 

 

 

 

Accelerated Lifetime Simulation Test

  • Early Life Failure Rate(ELFR):
  • ELFR defines methods for calculating the early life failure rate of a product using accelerated testing, whose failure rate is constant or decreasing over time. For technologies where there is adequate field failure data, alternative methods may be used to establish the early life failure rate. The purpose of this standard is to define a procedure for performing measurement and calculation of early life failure rates. Projections can be used to compare reliability performance with objectives, provide line feedback, support service cost estimates, and set product test and screen strategies to ensure that the ELFR meets customers' requirements.

 

  • High Temperature Operating Life Test(HTOL):
  • HTOL is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability. This test stresses the IC at an elevated temperature, high voltage and dynamic operation for a predefined period of time. The IC is usually monitored under stress and tested at intermediate intervals. This reliability stress test is sometimes referred to as a "lifetime test", "device life test" or "extended burn in test" and is used to trigger potential failure modes and assess IC lifetime.

 

Bathtub Curve

 

Acceleration Factors

 

 

 

Environment Test

  • High Temperature Storage Test :
  • To determine the effects of time and temperature on solid state devices stored at high temperature.

 

  • Low Temperature Storage Test :
  • To determine the effects of time and temperature on solid state devices under low temperature storage conditions. 

 

  • Temperature Humidity Storage Test :
  • To evaluate the reliability of non-hermetic packaged devices in humid environments.

 

  • Pressure Cook Test / High Accelerated Temperature & Humidity Stress Test :
  • To evaluate the reliability of non-hermetic packaged devices in temperature, humid, and pressured environments.

 

  • Temperature Cycling Test :
  • To determine the resistance of a part to mechanical stress induced by alternating between high and low temperature extremes.

 

  • Thermal shock Test :
  • To determine the resistance of a part suddenly exposed to extreme changes of temperature and to the effect of alternative exposures to these extremes.

 

  • High Temperature Operating Life Test :
  • To determine the lifetime of a device under electric biasing and high temperature stress. It simulates the devices operating condition in an accelerated way, and is used primarily for device qualification and reliability monitoring.

 

  • Precondition Test :
  • To evaluate the reliability of non-hermetic packaged devices in multiple solder reflow operation.

 

 

 

Board Level Reliability Test

  • Board Level Drop Test:
  • intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components while duplicating the failure modes normally observed during product level test.

 

  • Board Level Temperature cycle Test:
  • This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating betwee high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.

 

  • Board Level Monotonic Bend Test:
  • the monotonic bend testing method is intended to characterize the fracture strength of a components board-level interconnects. It is applicable to surface mount components attached to printed wiring boards using conventional solder reflow technologies. The monotonic bend characterization results provide a measure of fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations, and supplements existing standards that address mechanical shock or impact during shipping, handling or field operation.

 

  • Board Level Cyclic Bend Test:
  • To determine the resistance of a part to mechanical stress induced by alternating between high and low temperature extremes.

 

  • Strain Measurement:
  • To determine the lifetime of a device under electric biasing and high temperature stress. It simulates the devices operating condition in an accelerated way, and is used primarily for device qualification and reliability monitoring.

 

 

 

Transportation Test

  • Vibration Test:
  • Vibration testing is accomplished by introducing a forcing function into a structure, usually with some type of shaker. Alternatively, a DUT (device under test) is attached to the "table" of a shaker. Vibration testing is performed to examine the response of a device under tests (DUT) to a defined vibration environment. The measured response may be fatigue life, resonant frequencies or squeak and rattle sound output (NVH). Squeak and rattle testing is performed with a special type of quiet shaker that produces very low sound levels while under operation.

 

  • Mechanical Shock Test:
  • Shock testing typically falls into two categories, classical shock testing and pyroshock or ballistic shock testing. Classical shock testing consists of the following shock impulses: half sine, haversine, sawtooth wave, and trapezoid. Pyroshock and ballistic shock tests are specialized and are not considered classical shocks. Classical shocks can be performed on Electro Dynamic (ED) Shakers, Free Fall Drop Tower or Pneumatic Shock Machines. A classical shock impulse is created when the shock machine table changes direction abruptly. This abrupt change in direction causes a rapid velocity change which creates the shock impulse.

 

  • Drop Test:
  • A drop test is a method of testing the in-flight characteristics of a prototype or experimental aircraft and spacecraft by raising the test vehicle to a specific altitude and then releasing it. Test flights involving powered aircraft, particularly rocket-powered aircraft, may be referred to as drop launches due to the launch of the aircraft's rockets after release from its carrier aircraft.

 

 

EMS Test

  • EMS Test
  • Latch-up Test
  • Electromagnetic Compatibility Test
  • Test Condition

 

Contact

Taiwan Lab|Env. Testing

Mr. Li

: +886-3-6116678 ext:6555

: +886-970-131-196

:chihhsingli@ma-tek.com

Taiwan Lab|Electrical Testing

Mr. Wang

: +886-3-6116678 ext : 6535

: +886-922-301-672

: rarb@ma-tek.com

 

Shanghai Lab

Mr. Chu

: +86-21-5079-3616 ext:7098

: 135-8590-9286

: elevenzhu@ma-tek.com