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Non-destructive Analysis (NDA)

Circuit Edit (CKT)

Materials Analysis (MA)

Application Forms

Software

MA-tek FTP

3D X-ray

Technical Concept

3D X-ray microscopy constructs 3D tomography (CT) by computing 2D X-ray images captured with systematically rotating a sample between 0 and 360 degrees.

Due to its high penetration ability on many materials, the X-ray is a powerful tool to examine internal structures of substances. A plethora of applications have been found in biology, medicine, materials, and semiconductor device examination. For instance, X-ray can be used to observe internal structures of ICs, such as bond wires, silver glue, wires, etc.

 

Traditionally, 2D X-ray images are taken by shining X-ray radiation on samples of interest and collecting the transmission contrast. Based on this, X-ray would transmit and interact with all materials or structures within the path. All information is overlaid to each other and detailed structure (such as failure location in an IC) may not be clearly revealed.

 

The new state-of-the-art 3D X-ray microscopy Ma-tek holds strongly improves such drawbacks. It constructs 3D tomography (CT) by computing 2D X-ray images captured with systematically rotating a sample between 0 and 360 degrees. With its great non-destructive analyzing power, 3D X-ray microscopy has been applied not only for revealing failure location in a packed IC but also for failure analysis on MEMS, 3D IC and boards.

 

 

 

 

 

 

Applications

  • Can be used in microelectronics/materials science/nature resource and life science
  • Structure imaging on IC packages, MEMS, 3D ICs, and boards
  • Failure examination on various packages
  • This microscopy has a spatial resolution of ~ 700 nm and it is applicable to examine 8” and 12” wafer
  • Alternative 3D imaging other than SEM and FIB
  • Clear composition contrast
  • Light elements (such as Si and Al) are distinguishable

 

 

 (a) MEMS IC;(b) Module

 

Cu wire

 

Al wire

 

PCB layout

 

(a)PCB substrate;(b) TSV viod

 

 (a)Mini motor;(b) Wire lifting

 

 

 

 

 

FAQs

Q1.What machine was used to take the 3D picture of the moth?

The photo was captured using the 3D X-ray.

 

In addition to its uses in the fields of electronics and materials, the 3D X-ray can be a useful tool in biology and the life sciences. The moth in the picture is a species commonly found in bathrooms. The 3D image can be rotated so that the sample’s X-ray image can be viewed from different angles and not just from the front.

 

Q2.I observed an IC short-circuit phenomenon, but, after opening the cap (De-capping), the short-circuit phenomenon disappeared. It is suspected that the packaging is defective. How do I find the defect without de-capping the sample?

Use the 3D X-ray!

 

Sometimes, when a sample is subjected to destructive analysis (e.g. de-capping, grinding, FIB, etc.), the evidence at the crime scene is destroyed. This results in the loss of a great opportunity to find the cause of the failure. So we recommend that, before proceeding with destructive analysis, first use the 3D X-ray’s imaging technology to perform non-destructive analysis. Scan the original crime scene. This may help you find the clues you need to solve your case. Use these scans in combination with grinding, FIB and other techniques to fully explore the scene and obtain conclusive evidence.

 

 

 

Contact

Taiwan Lab

Ms. Wu

: +886-3-6116678 ext:3918 

: +886-952-301-656

uhr3dx@ma-tek.com

Shanghai Lab

Mr. Wang

: +86-21-5079-3616 ext:7035

: 159-2102-4495 

: chwang@ma-tek.com

 

 

 

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