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Non-destructive Analysis (NDA)

Circuit Edit (CKT)

Materials Analysis (MA)

Application Forms

Software

MA-tek FTP

CSR Report

2D X-ray

Technical Concept

2D X-ray imaging is shining X-ray radiation on an object of interest and taking its transmission contrast.

It can be used to inspect an IC’s internal metallic materials or structure, such as bond wire, silver glue, lead frame, etc.

 

 

 

Equipment

MA-tek has Feinfocus FXS-160.40 TIGER X-RAY and Dage XD7600NT.

 

FXS-160.40

Window control screen

 

Dage XD 7600NT

 

 

 

Application

X-ray is mainly used for examination of PCB assembly failures

  • Examination of solder on active/passivity components
  • Number of holes and ratio counting
  • Mixing-system components

 

The devices we could analyze:

  • Inductors/Sensors
  • Relay
  • Fuse
  • Coils/Winding
  • Bond wire
  • IC and die adhesion interface inspection

 

 

 (a) 0° Tilt, 0° Rotate;(b) 55° Tilt, 45° Rotate;(c) 55° Tilt, 135° Rotate;(d) 55° Tilt, 225° Rotate;(e) 55° Tilt, 315° Rotate

 

 

 

Contact

Taiwan|SoC Lab

Chemical team

: +886-3-6116678 ext:3919/3920

: +886-922-301-638

chemical_hc@ma-tek.com

Taiwan|JB Lab

Chemical team

: +886-3-6116678 ext:1601 / 1614 / 1622

: +886-970-923-650

chemical_jb@ma-tek.com

 

Shanghai Lab

Mr. Gao

: +86-21-5079-3616 ext:7011

: 182-2169-8031

chemical_sh@ma-tek.com

 

 

 

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