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Environmental Stress Test

Environmental stress test is used for validation the quality of packaged device.

There are several aspects to be considered, such as the endurance of temperature level of the package, the level of thermal resistance and moisture sensitivity of the package and, the storage and control. From devices production to delivery to the customer, the first thing faced is thermal stress during surface mount technology (SMT) or dual in-line package (DIP) assembly process. After that, the life time is taken into account.

 

Furthermore, since the Earth's environment is continuously polluted by human. The acidification of the air and rain affects the lifetime of many parts. Therefore, environmental testing to check the resistance of corrosion on exposed parts, such as connectors, PCB parts, terminals, and metal products is a necessity. The device level environmental stress test services provided by MA-tek are described as follows: 

 

 

Moisture Sensitivity Level(MSL)

Mainly used on surface mounted devices (SMD) or components that need to assembly through SMT reflow procedure. The moisture sensitivity level is determined through scanning acoustic tomography (SAT) or scanning acoustic microscopy (SAM) to detect delamination location and areal percentage.

 

 

Precondition Test

The testing is similar to that of the Moisture Sensitivity Level. However the purpose is different. Precondition aims to simulate the process start from manufacturing of the parts, transportation and usage in the customer side.

 

The test condition is according to the moisture sensitivity of the product. Based on the industry experience and due to the similarity of both test processes, most of the parts manufacturers merge these two test into one test.
 

 

Temperature Cycling Test

Temperaturecycle testing is a relatively important reliability test which alternates cycles between hot and cold temperatures. Due to the difference of thermal expansion coefficients among materials be used, the temperature cycle results in mechanical stress and causing fatigue. This stress is similar to the ON-OFF cycles of the product in daily operation.

 

 

High Temperature Storage Test

The purpose of this test is to verify the thermal resistance of the packaging materials in a continuous high temperature environment. The high temperature accelerates the  thermal aging process of the material.

 

 

Temperature Storage Test

The purpose of this test is to verify the thermal resistance of the packaging materials in a continuous low temperature environment. At low temperature, material losses its ductility. The contraction at low temperature results in mechanical stress which may induce material cracking.

  

 

Temperature Humidity Storage Test

Products are placed in a hot and humid environment to accelerate the chemical reaction which will result in  corrosion. In addition to the environment test without biasing the product, electrical bias is often applied to the package with metal to check the ion migration and in the same time to check the corrosion resistance of the product.

 

 

Highly Accelerated Stress Test

Similar, in principle, to the temperature humidity storage test, this test puts the product at higher temperatures and higher water vapor pressure which is larger than the atmospheric pressure. The high temperature and water vapor pressure accelerate corrosion rate in package and result in internal corrosion in bad packaged products.

 

 

Pressure Cooker Test

This test provides water vapor press at 2 atm to verify the process quality of the products. It is not a reasonable way to test the reliability of the product. Because some portions of the material, such as the BGA substrate, may lead into excessive damage.

 

 

Thermal Shock Test / Liquid to Liquid

In principle, this is similar to the temperature cycle test. The difference is the temperature change is faster. This test checks the resistance of the product to the extreme change between the low temperature and high temperature. The cracking of the package sealing, grain combing, wire bonding and the substrate can be tested.

 

 

Thermal Shock Test / Air to Air

This is for products with larger size. Unlike the temperature cycle test, Temperature changes in a short period of time by moving the product from one camber to the other chamber. It is a more representative test for verification of automobile products.

 

 

Salt Spray Test

The test is mainly used to simulate the corrosion of metal portion of a product in a harsh environment. The quality of the surface treatment of the metal can be tested. When the product is used in the island area or in high salinity environment, failure of the electrical contact resulted from the corrosion is happened frequently. The test can quickly verify the quality of the product by accelerating the corrosion.

 

 

Gas Corrosion Test

Air pollution due to emissions of exhaust is harmful to all types of electronic products. The main purpose of the gas corrosion test, is to test the resistance of the surface plating or coating of products to the corrosive gas. Unlike the salt spray test, gas corrosion test is more closer to the actual environment.

 

 

MA-Tek recruits senior industry personnel, who have many years of experience with semiconductor reliability testing, to offer customers satisfied service but also set up dedicated window to provide experimental design and overall planning. To ensure utmost experimental quality, MA-tek purchase internationally renowned equipments to provide customers with the best and most accurate test results. According to product specifications and customer requirements, MA-tek can perform MIL-STD, JEDEC, IEC, JESD, AEC, EIA and other different standard reliability tests.  

 

 

ESPEC TSA-71H

 

ESPEC TSB-51

     

ESPEC EHS 221MD

 

ESPEC PV-231M

     

ESPEC PL-4KP

 

台技SMD-10-M16HAO 

 

 

Contact

Taiwan Lab

Mr. Lee

: +886-3-6116678 ext:6555

: +886-970-131-196

: chihhsingli@ma-tek.com

Shanghai Lab

Mr. Chu

: +86-21-5079-3616 ext:7098

: 135-8590-9286

: elevenzhu@ma-tek.com