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Non-destructive Analysis (NDA)

Circuit Edit (CKT)

Materials Analysis (MA)

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Software

MA-tek FTP

Surface Mount Technology(SMT)

To provide timely service and stable product quality, MA-tek has set up a SMT assembling line for our customer. This SMT line includes solder paste printing machine (Solder Paste Printer), solder paste inspection machine (SPI), SMT (Mounter), reflow furnace, and high-magnification optical microscope.

 

The ambient control of the reflow furnace provides better quality of the soldering. The amount of solder paste and the Cpk of solder paste printing quality are automatically checked, respectively.All these function can help to eliminate the risk of quality resulted from the traditional blind spot sampling measurements.

 

For wafer level chip scale package (WLCSP) process, underfill is also provided. To meeting the scaling of the component, SMT (Mounter) in MA-tek is capable to handle the pin pitch as small as 0.25 mm, which is in a leading position in the domestic region.

 


MA-tek SMT Line

 


Schematic diagram of SMT technology

 

   

 

Solderability Test

Specification defines test methods including tin CHANNEL solder pot bath, wetting method (Solder Bath / DIP), surface mount simulation (Surface Mount Simulation Test) , etc, in which surface mount simulation method is the most common and mainstream. PCB Pad size design also has standards.

 

 

BGA Solderability testing sample

 

 

Contact

Taiwan Lab

Mr. Lee

: +886-3-6116678 ext:6530

: +886-918-102-857

: tomlee@ma-tek.com

Shanghai Lab

Mr. Chu

: +86-21-5079-3616 ext:7098

: 135-8590-9286

: elevenzhu@ma-tek.com