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Non-destructive Analysis (NDA)

Circuit Edit (CKT)

Materials Analysis (MA)

Application Forms

Software

MA-tek FTP

CSR Report

Others - FLASH, LOGIC, POWER, SiGe

TEM Analysis of ICs

 

(a)50 nm Gate Structure;(b)Ultra-thin Gate Dielectrics;(c)Via Structure

 

TEM/HAADF image of Silicide

 

(a) TEM;(b) HAADF

 

 

TEM Analysis of SiGe

High Resolution TEM Imaging

 

 

TEM Analysis of SRAM

Total delayer to expose the bare Si substrate

 

(a) Plan-view TEM;(b) Plan-view TEM

 

Dislocation in SRAM cell array

 

 

 

TEM Analysis of DRAM

HSG structure

 

Capacitor aspect ratio = 1.98/0.24= 8.25