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MA-tek FTP

CSR Report

Laser re-balling

Technical Concept

Laser re-balling system is a semi-automatic solder ball placement reflow/rework machine designed for small volume production, prototyping, and research and development.

The maximum throughput is 5 balls per second. The ball diameters range from 100μm to 250μm. It is an ideal tool for BGA and CSP rework jobs during electrical characterization or final tests.

 

 

 

 

Equipment


PacTech  SB2-M 

 

 

 

 

Applications

  • HDD (HGA, HSA, Hook-Up)
  • Flip-chip, BGA, cLCC, CSP
  • 3D packaging
  • 4- to 12-inch wafers
  • Repair/rework of BGA-like packages
  • Optoelectronics/Micro-optics
  • MEMS
  • Camera modules
  • Wafer bumping

 

 

 

Benefits

  • Single-step solder ball placement and reflow.
  • Single ball reballing and engineering handling
  • No special tooling required
  • No additional reflow required
  • Solder-ball diameter from – 250µm to 760µm
  • High solder alloy flexibility – Eutectic SnPb, High-lead SnPb, Lead-free SnAg, SnAgCu, etc.
  • In-line capability & High throughput
  • High accuracy axis system
  • Automated fiducial alignment
  • Ball rework and repair capability
  • 3D Camera – Height auto measurement
  • 2D bump-inspection systems
  • Integrated laser power sensor
  • Solder rework & reballing station
  • Automatic handling/robot system
  • Tray Unit

 

 

 

Contact

Taiwan|SoC Lab

Chemical team

: +886-3-6116678 ext:3919/3920

: +886-922-301638

: chemical_hc@ma-tek.com