We use cookies to improve your experience. By your continued use of this site you accept such use. To change your settings please see our Privacy Policy.

Non-destructive Analysis (NDA)

Circuit Edit (CKT)

Materials Analysis (MA)

Application Forms

Software

MA-tek FTP

CSR Report

Packaging & Bonding

Applications

To provide an electrical connection between the silicon chip and the external leads of the semiconductor device.

 


(a)Ball bonding (Gold & Copper wire)   (b)Wedge bonding (Aluminum wire)

  • Chip-on-board:COB bonding
  • Stacked dice / Multi PCB
  • High lead counts
  • Electroless Nickel and Immersion Gold: EN/IG
  • Re-bonding of COF and COG

 

 

 

Our Strength

  • High quality and stable bonding services
  • Fast cycle time : delivery in 3 business days
  • Flexibility to meet customer requests 
  • Total solutions : die saw, die mount, Al/Copper/Au wire-bonding, pull/shear test, fast packaging, SAT / X-ray inspection, electrical verification, etc.

 

 

 

Wire bonding cycle

 

 

Bonding cycle time

  • Normal - 5 business days
  • Urgent - 3 business days
  • Extra Urgent - 1 business day

 

 

Bonding case evaluation

 

 

Fine pitch capability- 22/26 um ultrafine bond pad pitch bonding capability

  • Au Wire-Bonding on 26/22 um pitch bonding pads (Linear).

 

Optical image of a 26um bond pad pitch product
* Gold wire dia. = 0.5 mil

Optical image of a 22um bond pad pitch product
* Gold wire dia. = 0.5 mil

 

SEM images of a 22um bond pad pitch product
* Gold wire dia. = 0.5 mil

 

 

  • Al Wire-Bonding on 50 um pitch bonding pads (Linear).

 


 

 



Bonding Package


(a) Chip-on-board 48 & 64L

(b) Chip-on-board 256L

(c) Chip-on-board 256L(Needle planting of COB) 

(d) Chip-on-board 256L(Needle planting of COB)


(a) SOP 8L Ceramic PKG

(b) DIP 20L Ceramic PKG

(c) DIP 40L Ceramic PKG 

(d) DIP 48L Ceramic PKG

 

 


(a) DIP 28L(300MIL) Ceramic PKG

(b) DIP 28L(600MIL) Ceramic PKG

(c) PLCC 68L Ceramic PKG

(d) QFN 7*7 48L Ceramic PKG


 

 

 

Contact

Taiwan Lab

Mr. Tien

: +886-3-6116678 ext:4533

: +886- - - - - - -

bonding@ma-tek.com

Shanghai Lab

Mr. Wang

: +86-21-5079-3616 ext:7032

: 138-1758-0946

: bonding_sh@ma-tek.com