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About

MA-tek is the worldwide leading analytical lab providing comprehensive and high-quality services.

Services

We provide wide span of materials, structure analysis, surface analysis, failure analysis, and reliability test.

Applications

We provide analytical consulting and technical support to high-tech industries, semiconductor manufacturing to system integration.

Tech Article

As the best R&D partners, we are willing to share our new insights and technical details with you.

Investors

All of the financial information are open and transparent to our shareholders.

Career

Aim to work as a medical center for high-tech industries, MA-tek welcome talents with professional background to join us.

Download

MA-tek had been certificated by ISO 9001, 27001, 17025, 15408 and ESD20.20. You are welcome to download the certificates for reference.

Press Release

You may visit our latest technology update, events and media kits.

Contact

Please find the business contacts you need and ask for a instant logistics support anytime.

Non-destructive Analysis (NDA)

Circuit Edit (CKT)

Materials Analysis (MA)

Application Forms

Software

MA-tek FTP

CSR Report

How can we help you? Get in touch with us

Contact us !

Packaging & Bonding

Applications

To provide an electrical connection between the silicon chip and the external leads of the semiconductor device.

 


(a)Ball bonding (Gold & Copper wire)   (b)Wedge bonding (Aluminum wire)
  • Chip-on-board：COB bonding
  • Stacked dice / Multi PCB
  • High lead counts
  • Electroless Nickel and Immersion Gold: EN/IG
  • Re-bonding of COF and COG

 

 

 

Our Strength
  • High quality and stable bonding services
  • Fast cycle time : delivery in 3 business days
  • Flexibility to meet customer requests 
  • Total solutions : die saw, die mount, Al/Copper/Au wire-bonding, pull/shear test, fast packaging, SAT / X-ray inspection, electrical verification, etc.

 

 

 

Wire bonding cycle

 

 

Bonding cycle time
  • Normal - 5 business days
  • Urgent - 3 business days
  • Extra Urgent - 1 business day

 

 

Bonding case evaluation

 

 

Fine pitch capability- 22/26 um ultrafine bond pad pitch bonding capability
  • Au Wire-Bonding on 26/22 um pitch bonding pads (Linear).

 

Optical image of a 26um bond pad pitch product
* Gold wire dia. = 0.5 mil

Optical image of a 22um bond pad pitch product
* Gold wire dia. = 0.5 mil

 

SEM images of a 22um bond pad pitch product
* Gold wire dia. = 0.5 mil

 

 

  • Al Wire-Bonding on 50 um pitch bonding pads (Linear).

 


 

 



Bonding Package

(a) Chip-on-board 48 & 64L

(b) Chip-on-board 256L

(c) Chip-on-board 256L(Needle planting of COB) 

(d) Chip-on-board 256L(Needle planting of COB)

(a) SOP 8L Ceramic PKG

(b) DIP 20L Ceramic PKG

(c) DIP 40L Ceramic PKG 

(d) DIP 48L Ceramic PKG

 

 


(a) DIP 28L(300MIL) Ceramic PKG

(b) DIP 28L(600MIL) Ceramic PKG

(c) PLCC 68L Ceramic PKG

(d) QFN 7*7 48L Ceramic PKG

 

 

 

Contact

Taiwan Lab

Mr. Tien

: +886-3-6116678 ext：4533

: +886- - - - - - -

: bonding@ma-tek.com

Shanghai Lab

Mr. Wang

: +86-21-5079-3616 ext：7032

: 138-1758-0946

: bonding_sh@ma-tek.com

Contact us !