Packaging & Bonding
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Applications |
To provide an electrical connection between the silicon chip and the external leads of the semiconductor device.
 (a)Ball bonding (Gold & Copper wire) (b)Wedge bonding (Aluminum wire) |
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Our Strength |
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Wire bonding cycle |
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Bonding cycle time |
- Normal - 5 business days
- Urgent - 3 business days
- Extra Urgent - 1 business day
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Bonding case evaluation |
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Fine pitch capability- 22/26 um ultrafine bond pad pitch bonding capability |
- Au Wire-Bonding on 26/22 um pitch bonding pads (Linear).
Optical image of a 26um bond pad pitch product |
Optical image of a 22um bond pad pitch product |
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SEM images of a 22um bond pad pitch product
* Gold wire dia. = 0.5 mil
- Al Wire-Bonding on 50 um pitch bonding pads (Linear).
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Bonding Package |
 (a) Chip-on-board 48 & 64L (b) Chip-on-board 256L (c) Chip-on-board 256L(Needle planting of COB) (d) Chip-on-board 256L(Needle planting of COB) |
 (a) SOP 8L Ceramic PKG (b) DIP 20L Ceramic PKG (c) DIP 40L Ceramic PKG (d) DIP 48L Ceramic PKG |
 (a) DIP 28L(300MIL) Ceramic PKG (b) DIP 28L(600MIL) Ceramic PKG (c) PLCC 68L Ceramic PKG (d) QFN 7*7 48L Ceramic PKG |
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Contact |
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