Introduction and Fundamental Principles

Introduction of Materials Analyses Techniques - OM/SEM/TEM/FIB/EDX/Auger/SIMS/RBS/TXRF

¡DFundamental Principles & Image Formation Mechanisms [2 hrs]
¡DApplications of Each Tool [4 hrs]

Imaging Techniques of Physical Analysis Tools - OM/SEM/TEM/FIB

¡DImage Formation Mechanisms [2 hrs]
¡DAdvantages and Applications of Each Tool [4 hrs]

TEM Sample Preparation Techniques

¡DThinning methods of Si, TFT, III-V's [2 hrs]
¡DSelective Layer Removal and Parallel Lapping [1 hr]
¡DHand-on Hours [4 hrs]

Advanced Study and Field Application

Applications of TEM in the Process Development of Si IC Manufacturing

¡DTEM Imaging Techniques [1 hr]
¡DPhase Identification & Grain Imaging [1 hr]
¡DProcess Induced Substrate Damage [1 hr]
¡DDefects Multiplication in Si Substrate [3 hrs]
¡DReverse Engineering of Competitive Products [2 hrs]

Applications of TEM in Materials Analyses

¡DCapability of TEM Imaging Techniques [1 hr]
¡DObservation of AlGaAs/GaAs Surface Emitting Laser [1 hr]
¡DOvergrowth of YBCO on TiO2 [1 hr]
¡DEpitaxial Growth of FeSi3/GaAs [30 mins]
¡DEpitaxial Growth of Ion Implanted CoSi2 in Si [2 hrs]
¡DCharacterization of Substrate Defects [3 hrs]
¡DReverse Engineering of Competitive Products [2 hrs]

Defect Formation and Multiplication During Si IC's Processing

¡DThermal Treatment Induced Defects Formation [1 hr]
¡DEtching Process Induced Substrate Damage [1 hr]
¡DIon Implantation Induced Defects Multiplication in Si Substrate [3 hrs]

Ion Implantation induced Lattice Defects in Si Integrated Circuit

¡DResidual Defects after Ion Implantation and Post Implantation Annealing [1 hr]
¡DGate Edge Induced Defect Formation [1 hr]
¡DDesign Rule Induced Defect Formation [1 hr]
¡DDefects Multiplication in Contact Hole [1 hr]

Application of Materials Analyses in TFT-LCD Industry

¡DIntroduction of Popular Tools [1 hr]
¡DLimitation of Sample Preparation [1 hr]
¡DApplications in TFT & LCD Processes [2 hrs]
¡DFailure Analysis of LCM Panels [2 hrs]

Introduction and Fundamental Principles

Introduction of Failure Analysis Techniques

¡DOverview of FA Tools ¡V Electrical/Thermal/ Photonic Techniques [2 hrs]
¡DFA Process Flow [2 hrs]
¡DCase Study - Identification of Failure Mode and Failure Mechanisms [2 hrs]
¡DSelective Layer Removal and Parallel Lapping [1 hr]

Introduction of FIB and It's Applications

¡DFundamental Principle of FIB [2 hrs]
¡DApplication of FIB in Circuit Debugging [1 hr]
¡DApplication of FIB in Failure Analysis of Si Integrated Circuit [2 hrs]

Introduction of Reliability Testing

¡DEarly Failures and Bath Tub Curves [1 hr]
¡DTest Items [2 hrs]
¡DTest Spec. [2 hrs]
¡DEstimation of Acceleration Factors and Determination of Test Conditions [2 hrs]

TEM Imaging and Operation Techniques

¡DTEM Instrumentation [1 hr]
¡DFundamental Principle [1 hr]
¡DImaging Techniques [2 hrs]
¡DOperation and Maintenance [1 hrs]
¡DAccessory and Attachments ¡V EDX, EELS, PEELS [2 hr]
¡DHand-on Hours [4 hrs]

SEM Imaging and Operation Techniques

¡DSEM Instrumentation [1 hr]
¡DFundamental Principle [1 hr]
¡DImaging Techniques [2 hrs]
¡DOperation and Maintenance [1 hr]
¡DAccessory and Attachments ¡V EDX, WDS, BSE [2 hr]
¡DHand-on Hours [4 hrs]

¡@