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Project Service

1.Patent Identification
For the circuitry layout and manufacture technology of advances electronic product, patent infringement identification is the major way to protect the copyright of high-tech Company. That always influences the consult of tactic analysis regarding the claim and the technical report writing. Ma-tek Inc. has a lot of experiences in the field, can directly provide customer the service, and can also cooperation with the law office that customer assigned.
 
 
2.Third party witness report
Ma-tek has obtained ISO9000 and IECQ17025 certification on June, 2004. Our laboratories are qualified and got very highly appraisal from the customer in the area of material analysis, electrical failure analysis, ESD and reliability test. Our exceptional technique teams are able to handle the specific case with professional analysis. We can published the impartial/reliable report by way of perfection analysis and follow the regulation format of ISO/IECQ.
 
 
3.Laboratory set-up  
Ma-tek can help the customer to set-up a laboratory with actual requirement. Before accepting the project, we could provide a proposal of laboratory scheme that included equipments, estimating, purchase, technique training and the course of laboratory management.
 
 
4.FA technique transfer
Ma-tek welcomed the customer to request the techniques transfer of specific analysis technique. We not only provide a series training courses/ tool operation and also provide the standard operation procedural.
 
 
5.Training courses
Ma-tek in pursuit of raising customer to know the analysis technology, we provide a series training course as following:
  1. Introduction of material analysis:
    The contents is to introduce the M/SEM/FIB/TEM/SIMS/EDX/Auger ..etc.
  2. TEM sample preparation:
    The content contains sample preparation of Si/TFT/III-V’s,P-V TEM.
  3. TEM imaging and principle of operation:
    The content contains introduction of tool maintenance, basic principle of TEM imaging technique, EELS,EDX.
  4. SEM imaging and principle of operation:
    The content contains introduction of tool maintenance, basic principle of SEM imaging technique, EDX/WDX/BSE.
  5. Introduction of reliability testing:
    The content contains introduction of test tool, test principle and the standard.
  6. Introduction of FIB and application:
    The content contains principle, circuit repair technique and its application. The limitation/application of FIB used in FA.
  7. Introduction of failure analysis:
    The content contains: Introduction of EFA tools (EMMI/OBIRCH/InGaAS/HP4156C/C-AFM..etc),the principle, EFA and PFA introduction and FA flow, case study.
  8. Introduction of special case: (IC/ TFT/ LED/ Nano-Materials/ Solar Cell/ Packaging)
 
Contact Window
Venson Lee
Tel:+886-3-6116678 ext:3820
Mobile:+886-952-301656
Email:project@ma-tek.com
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