Reliability Testing
Reliability Technical Concept
Reliability is ability of products to perform specific function(s) at standard technical conditions for a specific period of time. Reliability is measured as failure probability, failure rate, and maintainability of products. Based on projected/actual technical specification of products and customer requirements, different reliability tests are performed as per different reliability testing standards via. MIL-STD, JEDEC, IEC, JESD, AEC, and EIA.
Equipment Capacity & RA Service
High Temperature Storage test (HTST)：ESPEC PV-231M
Low Temperature Storage test (LTST)：ESPEC :PL-4KP PSL-2KH
Temperature & Humidity Storage test (THST)：ESPEC :PL-4KP PSL-2KH
Temperature & Humidity with bias test (THB)：ESPEC :PL-4KP PSL-2KH
Pressure Cooker test (PCT/UB-HAST) test：ESPEC EHS-221MD
Highly Accelerated Stress test (HAST)：ESPEC EHS-221MD
Temperature Cycling test (TCT)：ESPEC TSA-71H
Thermal Shock test (TST)：ESPEC TSB-51
High Temperature Operation Life test (HTOL)：KYEC KYE 680 SSE B1120M
Bias Life test (BLT)：KYEC KYE 680 SSE B1120M
Reflow test：TANGTECK SMD-10-M16HAO
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| ESPEC PV-231M |
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ESPEC PL-4KP PSL-2KH |
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ESPEC EHS-221MD |
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| ESPEC TSA-71H |
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ESPEC TSB-51 |
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SSE B1120M |
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| TANGTECK SMD-10-M16HAO |
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Technical Concept
Reliability is the probability of performing without failure at a specific function under given condition for a specific period of time.
Key factors :
‧Probability (Failure rate)
‧It can work under a test condition (Temp. / Humidity / Bias / pressure/....)
‧A specific period (Using time)
‧A specific function
Environment Test
- To determine the effects of time and temperature on solid state devices stored at high temperature.
- To determine the effects of time and temperature on solid state devices under low temperature storage conditions.
- To evaluating the reliability of non-hermetic packaged devices in humid environments.
- To evaluating the reliability of non-hermetic packaged devices in temperature, humid and pressure environments.
- To determine the resistance of a part to mechanical stress induced by alternating high and low temperature extremes.
- To determine the resistance of a part suddenly exposed to extreme changes of temperature and to the effect of alternative exposures to these extremes.
- To determine the life time of device under electric biasing and high temperature storage. It simulates the devices operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring.
- To evaluate the reliability of non-hermetic packaged devices in multiple solder reflow operation.。
Contact Window
Ethan Huang
TEL：+886-3-6116678 ext：6533
