Packaging / Bonding
- High quality and stable bonding services
- Fast cycle time : 3 working days delivery
- Flexibility to meet customer requests
- Total solutions : die saw, die mount, Al/Copper/Au wire-bonding, pull/shear test, fast packaging, SAT / X-ray inspection, electrical verification, etc.
Wire bonding Purpose & Applications
To provide electrical connection between the silicon chip and the external leads of the semiconductor device.
．Chip-on-board:COB bonding
．Stacked dice / Multi PCB
．High lead counts
．Electroless Nickel and Immersion Gold: EN/IG
．Re-bonding of COF and COG
Ball bonding
(Gold & Copper wire) |
Wedge bonding
(Aluminum wire) |
Wire bonding cycle
Bonding cycle time
‧Normal - 5 Working day
‧Urgent - 3 Working day
‧Extra urgent - 1 Working day
Fine pitch capability - 22/26 um ultra fine bond pad pitch bonding capability.
a.) Au Wire-Bonding on 26/22 um pitch bonding pads (Linear)..
|
Optical image of a 26um bond pad pitch product
* Gold wire dia. = 0.5 mil
|
Optical image of a 22um bond pad pitch product
* Gold wire dia. = 0.5 mil
|
SEM images of a 22um bond pad pitch product
* Gold wire dia. = 0.5 mil |
b.) Al Wire-Bonding on 50 um pitch bonding pads (Linear).
Bonding Package：
| Chip-on-board 48 & 64L |
Chip-on-board 256L |
Chip-on-board 256L(Needle planting of COB) |
Chip-on-board 256L(Needle planting of COB) |
| SOP 8L Ceramic PKG |
DIP 20L Ceramic PKG |
DIP 40L Ceramic PKG |
DIP 48L Ceramic PKG |
| DIP 28L(300MIL) Ceramic PKG |
DIP 28L(600MIL) Ceramic PKG |
PLCC 68L Ceramic PKG |
QFN 7*7 48L Ceramic PKG |
Contact Window
Mr. Eric Gu
Tel：+886-3-6116678 ext:6920
