Company Profile
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Technical Team
Service Scope
Worldwide Customer
Service Locations
Awards
Alliance Partners
FIB Analysis
Electrical Failure Analysis
Decap / Delayer
Chemical Decap
Laser Decap
Delayer (chemicaldry etching and polish)
I-V measurement
EMMI
InGaAs
OBIRCH
C-AFM
Thermal Emission Microscope
Non-destructive Analysis
OM(Optical Microscope)
OP(Optical Profiler)
X-ray Examine
SAT(Scanning Acoustic Tomography)
Material Analysis
Sample preparation
Mechanical Polishing
FIB Precision Cutting
TEM (Transmission Electron Microscope)
TEM (Transmission Electron Microscope)
Osiris
Scanning Capacitance Microscopy Service
SEM (Scanning Electron Microscopy)
Surface Analysis
SIMS(Secondary Ion Mass Spectrometry)
XPS/ESCA
High Resolution XRD Service
Field Emission Auger Electron Spectroscopy (FE-AES) Service
Scanning Capacitance Microscopy Service
Spreading Resistance Probe (SRP)
Packaging / Bonding
ESD Testing & Design Service
Reliability Testing
Benchmark Analysis
IC Imaging
Benchmark Analysis
Project Service
Tools For Sale
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公司治理
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Contacts
index
> Service
FIB Analysis
Electrical Failure Analysis
Decap / Delayer
Chemical Decap
Laser Decap
Delayer (chemicaldry etching and polish)
I-V measurement
EMMI
InGaAs
OBIRCH
C-AFM
Thermal Emission Microscope
Non-destructive Analysis
OM(Optical Microscope)
OP(Optical Profiler)
X-ray Examine
SAT(Scanning Acoustic Tomography)
Material Analysis
Sample preparation
Mechanical Polishing
FIB Precision Cutting
TEM (Transmission Electron Microscope)
TEM (Transmission Electron Microscope)
Osiris
Scanning Capacitance Microscopy Service
SEM (Scanning Electron Microscopy)
Surface Analysis
SIMS(Secondary Ion Mass Spectrometry)
XPS/ESCA
High Resolution XRD Service
Field Emission Auger Electron Spectroscopy (FE-AES) Service
Scanning Capacitance Microscopy Service
Spreading Resistance Probe (SRP)
Packaging / Bonding
ESD Testing & Design Service
Reliability Testing
Benchmark Analysis
IC Imaging
Benchmark Analysis
Project Service
Tools For Sale
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