Material Analysis(Sample preparation)
Mechanical Polishing
Technical Concept
Sample preparation is the very important technology to perform material analysis and failure analysis. MA-tek provides versatile and accurate technology of sample preparation.
- provides technology of de-layer by chemical wet etching , RIE dry etching and mechanical polishing. Oxide, metal and protective layer of nitride can be de-layered by those technology.
- Laser cutting and marking which cut metal line and precisely mark the failure location.
- Specimen preparation by FIB for STEM/ TEM observation, either single or double sides cutting, to clearly reveal the process result and defect of 65nm and below technology device.
- Precision mechanical polishing to prepare TEM specimen provides thin region, beyond 50 um, for TEM observation. Either Si or non-Si material can be polished.
Equipment Capacity
| Chemical hood |
Ion miller for TEM sample preparation |
optical microscopy with Low magnification and high magnification |
mechanical polishing machine |
| the sample polished by mechanical polishing |
Hitachi IM 4000 Ion Milling System |
Leica EM TIC020 Triple Ion-Beam Cutter |
Application
SEM Sample Preparation：
Epoxy (cold) Mounting
TEM Sample Preparation：
Good Polishing Uniformity
The thickness of the sample was reduced by wedge thinning
TEM sample prepared by mechanical polishing
Contact Window
Mr. Defu Chang
Tel：+886-3-6116678 ext：3673
Mobile：+886-952-301662
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