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X-ray Examine
Technical Concept
The imaging principle is to utilize the X-ray which transmitting through the objective and to form the image by CCD. The major purpose is to inspect the metallic material or structure of IC, such as bonding wires, silver glue and lead frame...etc.
Equipment Capacity
| FXS-160.40 |
Window control screen |
Application
This system was designed specifically for the PCB Assembly Market BGA Inspection
．Solder Interconnects of Active & Passive Components
．Voiding Calculation
．Hybrid Components
Additionally, useful for inspection of electromechanical components, which are encapsulated :
‧Sensors
‧Relays
‧Fuses
‧Coils
‧Wirebonds
‧Die-Attach
| 0° Tilt, 0° Rotate |
55° Tilt, 45° Rotate |
55° Tilt, 135° Rotate |
55° Tilt, 225° Rotate |
55° Tilt, 315° Rotate |
Contact Window
Chemical Dept.：
Tel：+886-3-6116678 ext：2601~3
Mibile：+886-922-301638
Technical Consultant：
PS Kuo
Tel：+886-3-6116678 ext：2300
Mobile：+886-952-303815
Email：HC_PFA@ma-tek.com
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