Electrical Failure Analysis(Decap / Delayer)
Delayer (chemicaldry etching and polish)
Technical Concept
To remove the epoxy or compound of IC by laser beam etching. It can be well control the accuracy of open window and reduce the influence of electrical characteristic of IC due to over etching.
Equipment Capacity
Reactive ion etcher (RIE)
Polish equipments
Application
Ma-tek has rich experience and technologies in IC delayer process and provide alternative methods to customer :
(1)Chemical wet etching
(2)RIE dry etching
(3)Mechanical polish
Structure analysis (FA) and reverse engineering are the major applications of delayer. In failure analysis, layer by layer checking/inspection, it can be identified if the defect is caused by process issue such as etching residue, metal crack or broken, oxide defect and poor via connection. In applications of reverse engineering, we can trace back the layout and circuitry. Delayer is the most important technology in sample preparation of IC failure analysis. Ma-tek has earned the confidence and approbation from customer in this technology.
OM Imaging
SEM Imaging
Contact Window
Chemical Dept.：
Tel：+886-3-6116678 ext：2601~3
Mobile：+886-922-301638
Project Dept.：
Tel：+886-3-6116678 ext：2651
Mobile：+ 886- 922-303814
Technical Consultant：
PS Kuo
Tel：+886-3-6116678 ext：2300
Mobile：+886-952-303815
