Company Profile
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Worldwide Customer
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Awards
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FIB Analysis
Electrical Failure Analysis
Decap / Delayer
Chemical Decap
Laser Decap
Delayer (chemicaldry etching and polish)
I-V measurement
EMMI
InGaAs
OBIRCH
C-AFM
Non-destructive Analysis
OM(Optical Microscope)
OP(Optical Profiler)
X-ray Examine
SAT(Scanning Acoustic Tomography)
Material Analysis
Sample preparation
Mechanical Polishing
FIB Precision Cutting
SEM (Scanning Electron Microscopy)
TEM (Transmission Electron Microscope)
Surface Analysis
SIMS(Secondary Ion Mass Spectrometry)
XPS/ESCA
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ESD Testing & Design Service
Reliability Testing
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IC Imaging
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MA-tek FTP
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Investor Releations
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Financials
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Annual Reports
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Contacts
Material Information
Material Information
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