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Patent Infringement
Third Party Witness Report
Analytical Lab Planning and Establishment
MA, FA Technology Transfer
Packaging
256 pins PCB for COB bonding
Al wire Bonding [min. pitch 60
m
m]
Au wire Bonding[min. pitch 35
m
m]
Needle Planting
Epoxy Encapsulation
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copyright 2006 Materials Analysis Technology Inc. Best Viewed in MSIE.
TEL : + 886-3-5526678 FAX : + 886-3-6005883 1F, No.26-2, Tai Yuen St., Jubei city, Hsinchu county, Taiwan 302
Laser Mark / Cut
X-ray Radiography
SAT(Scanning Acoustic Tomography)
EMMI(Emission Microscope)
OBIRCH(Optical Beam Induced Resistance Change)
LC (Liquid Crystal Detection)
PVC(Passive Voltage Contrast)
I-V Characterization
OLT (Operation Life Test)
PCT (Pressure Cook Test)
THT (Temperature / Humidity Test)
TST (Thermal Shock Test)
TCT (Temperature Cycle Test)
HALT (High Temperature Acceleration Life Test)
Ion Migration Measurement
Solder Joint Reliability
Repeated Bending Reliability
SLT (Storage Life Test)
Decapsulation
Delayering (Delayering of Cu damascene process)
Sample preparation
SEM (Scanning Electron Microscope)
TEM (Transmission Electron Microscope)
FIB (Focused Ion Beam)
SIMS (Secondary Ion Mass Spectrometry)
Optical Profiler
ESD/Latch-up Testing
ESD/Latch-up Design Services
I/O cell library
Die Saw
Needle Planting
Die Mount
Wire Bonding
Epoxy Encapsulation
COG/COF/FOG
Ceramic Packaging
copyright 2006 Materials Analysis Technology Inc. Best Viewed in MSIE.