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Patent Infringement
Third Party Witness Report
Analytical Lab Planning and Establishment
MA, FA Technology Transfer
PFA (Physical Failure Analysis)
Decapsulation
ĄDWet etching by chemical solutions
ĄDAuto decapsulation
ĄDLaser Decap
Delayering (Delayering of Cu damascene process)
ĄDWet etching by chemical solutions
ĄDDry etching by RIE (Reactive Ion Etcher)
Sample preparation
ĄDPlan-view
ĄDCross-sectioning
ĄDParallel lapping
ĄDLaser Cut
SEM (Scanning Electron Microscope)
TEM (Transmission Electron Microscope)
FIB (Focused Ion Beam)
SIMS (Secondary Ion Mass Spectrometry)
ĄDTools (model number)
ĄDIndustrial applications
Optical Profiler
ĄDTools (model number)
ĄDIndustrial applications
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copyright 2006 Materials Analysis Technology Inc. Best Viewed in MSIE.
TEL : + 886-3-5526678 FAX : + 886-3-6005883 1F, No.26-2, Tai Yuen St., Jubei city, Hsinchu county, Taiwan 302
Laser Mark / Cut
X-ray Radiography
SAT(Scanning Acoustic Tomography)
EMMI(Emission Microscope)
OBIRCH(Optical Beam Induced Resistance Change)
LC (Liquid Crystal Detection)
PVC(Passive Voltage Contrast)
I-V Characterization
OLT (Operation Life Test)
TST (Thermal Shock Test)
HALT (High Temperature Acceleration Life Test)
Ion Migration Measurement
Solder Joint Reliability
THT (Temperature / Humidity Test)
TCT (Temperature Cycle Test)
Repeated Bending Reliability
SLT (Storage Life Test)
PCT (Pressure Cook Test)
Decapsulation
Delayering (Delayering of Cu damascene process)
Sample preparation
SEM (Scanning Electron Microscope)
TEM (Transmission Electron Microscope)
FIB (Focused Ion Beam)
SIMS (Secondary Ion Mass Spectrometry)
Optical Profiler
ESD/Latch-up Testing
ESD/Latch-up Design Services
I/O cell library
Die Saw
Needle Planting
Die Mount
Wire Bonding
Epoxy Encapsulation
COG/COF/FOG
Ceramic Packaging
copyright 2006 Materials Analysis Technology Inc. Best Viewed in MSIE.