Introduction and Fundamental Principles

Introduction of Materials Analyses Techniques - OM/SEM/TEM/FIB/EDX/Auger/SIMS/RBS/TXRF

．Fundamental Principles & Image Formation Mechanisms [2 hrs]
．Applications of Each Tool [4 hrs]

Imaging Techniques of Physical Analysis Tools - OM/SEM/TEM/FIB

．Image Formation Mechanisms [2 hrs]
．Advantages and Applications of Each Tool [4 hrs]

TEM Sample Preparation Techniques

．Thinning methods of Si, TFT, III-V's [2 hrs]
．Selective Layer Removal and Parallel Lapping [1 hr]
．Hand-on Hours [4 hrs]

Advanced Study and Field Application

Applications of TEM in the Process Development of Si IC Manufacturing

．TEM Imaging Techniques [1 hr]
．Phase Identification & Grain Imaging [1 hr]
．Process Induced Substrate Damage [1 hr]
．Defects Multiplication in Si Substrate [3 hrs]
．Reverse Engineering of Competitive Products [2 hrs]

Applications of TEM in Materials Analyses

．Capability of TEM Imaging Techniques [1 hr]
．Observation of AlGaAs/GaAs Surface Emitting Laser [1 hr]
．Overgrowth of YBCO on TiO2 [1 hr]
．Epitaxial Growth of FeSi3/GaAs [30 mins]
．Epitaxial Growth of Ion Implanted CoSi2 in Si [2 hrs]
．Characterization of Substrate Defects [3 hrs]
．Reverse Engineering of Competitive Products [2 hrs]

Defect Formation and Multiplication During Si IC's Processing

．Thermal Treatment Induced Defects Formation [1 hr]
．Etching Process Induced Substrate Damage [1 hr]
．Ion Implantation Induced Defects Multiplication in Si Substrate [3 hrs]

Ion Implantation induced Lattice Defects in Si Integrated Circuit

．Residual Defects after Ion Implantation and Post Implantation Annealing [1 hr]
．Gate Edge Induced Defect Formation [1 hr]
．Design Rule Induced Defect Formation [1 hr]
．Defects Multiplication in Contact Hole [1 hr]

Application of Materials Analyses in TFT-LCD Industry

．Introduction of Popular Tools [1 hr]
．Limitation of Sample Preparation [1 hr]
．Applications in TFT & LCD Processes [2 hrs]
．Failure Analysis of LCM Panels [2 hrs]

Introduction and Fundamental Principles

Introduction of Failure Analysis Techniques

．Overview of FA Tools – Electrical/Thermal/ Photonic Techniques [2 hrs]
．FA Process Flow [2 hrs]
．Case Study - Identification of Failure Mode and Failure Mechanisms [2 hrs]
．Selective Layer Removal and Parallel Lapping [1 hr]

Introduction of FIB and It's Applications

．Fundamental Principle of FIB [2 hrs]
．Application of FIB in Circuit Debugging [1 hr]
．Application of FIB in Failure Analysis of Si Integrated Circuit [2 hrs]

Introduction of Reliability Testing

．Early Failures and Bath Tub Curves [1 hr]
．Test Items [2 hrs]
．Test Spec. [2 hrs]
．Estimation of Acceleration Factors and Determination of Test Conditions [2 hrs]

TEM Imaging and Operation Techniques

．TEM Instrumentation [1 hr]
．Fundamental Principle [1 hr]
．Imaging Techniques [2 hrs]
．Operation and Maintenance [1 hrs]
．Accessory and Attachments – EDX, EELS, PEELS [2 hr]
．Hand-on Hours [4 hrs]

SEM Imaging and Operation Techniques

．SEM Instrumentation [1 hr]
．Fundamental Principle [1 hr]
．Imaging Techniques [2 hrs]
．Operation and Maintenance [1 hr]
．Accessory and Attachments – EDX, WDS, BSE [2 hr]
．Hand-on Hours [4 hrs]