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物性分析 (Physical Failure Analysis,PFA),材料分析(Materials Analysis,MA)
| 去IC封裝 |
．Wet etching by chemical solutions
．Auto decapsulation
．Laser Decap
|
| IC層次去除 |
．Wet etching by chemical solutions
．Dry etching by RIE (Reactive Ion Etcher)
|
| 試片製備 |
．Plan-view
．Cross-sectioning
．Parallel lapping
．Laser Cut
|
| 二次離子質譜儀 |
．Tools (cameca 6f , Atomica 4500)
．Industrial applications
|
| 光學干涉形貌儀 |
．Tools (nano view NVE1010)
．Industrial applications
|
|
copyright 2006