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FIB Analysis
Electrical Failure Analysis
Decap / Delayer
Decap by chemical wet etching
Decap by laser etching
Delayer (chemicaldry etching and polish)
I-V measurement
EMMI
OBIRCH
InGaAs
C-AFM
Non-destructive Analysis
OM(Optical Microscope)
OP(Optical Profiler)
X-ray Examine
SAT(Scanning Acoustic Tomography)
Material Analysis
Sample preparation
Mechanical Polishing
FIB Precision Cutting
SEM (Scanning Electron Microscopy)
TEM (Transmission Electron Microscope)
Surface Analysis
SIMS(Secondary Ion Mass Spectrometry)
XPS/ESCA
Packaging / Bonding
ESD Testing & Design Service
Reliability Testing
Reverse Engineering
IC Imaging
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FIB Analysis
Electrical Failure Analysis
Non-destructive Analysis
Material Analysis
Surface Analysis
Packaging / Bonding
ESD Testing & Design Service
Reliability Testing
Reverse Engineering
Project Service
2010-03-12 —
NTHU Happy Fit Sharing Seminar
2010-02-25 —
MA-tek donated one piece of sculpture to IAMS Academia Sinica
IC industry
‧
IC Design
‧
IC Manufacture
‧
IC Packaging & Testing
LED industry
‧
Wafer Level
‧
Chip Level
Solar Energy industry
‧
Total solution of Solar cell
‧
Example of Solar cell
Other Industries
(
TFT-LCD
,
CMOS Image Sensor
,
DVD
,
Nano Materials
,
HD Disk
Metal Diffusion in Glass
)
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